Material: FR4, final 1.6mm
Specification: 4-layer PCB, final copper 2OZ, LPI (green), Chemical Gold, 2 BGA, white silkscreen, vacuum packing
Feature: ENIG, BGA with min hole 0.2mm

Max Layer Count for rigid PCB: 1-12
PCB Board Thickness: 14mil-175mil
Drill to Metal: 7mil
Hole Size: 6mil
Inner layer Registration: 3mil
Line Width & Space Inner/Outer: 3mil/3mil (minimum)
Aspect Ratio: Min Solder mask Dam: 2.5mil
Controlled Impedance: +/- 8%
Max Internal Copper Wt.: 3 oz
Advanced Technologies: Blind/Buried Via, HDI Micro via
Surface Treatment: ENIG, OSP, Immersion Silver/Tin, Lead free HAL
Materials: FR4, High Tg Epoxy, Halogen Free
Certificates: TS16949, ISO14001 and UL
Price: Quite competitive especially for orders in huge quantities
Products application: Computer, Communication, Test & Control system, Medical Equipment etc.
Lead Time: 5-20 days (Depends on Q'ty, production status etc. )
Delivery Mode: UPS, DHL, FedEx, TNT, standard flight & vessel